Buy Custom PCBA Services for Inventory Control Programming Suppliers

14-08-2019

PCBA Services for Inventory Control Programming

There is such a problem, we often found in the PCBA processing, when the shipment of PCBA board functional indicators are normal, but after a short period of use, the customer will find that there will be a variety of bad conditions, so in fact, the aging test of PCBA processing products is still very necessary.


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Aging test in general is to simulate the external environment of PCBA processing finished product testing, make the function board in a temperature change of heat aging equipment, through the change of air temperature, high temperature, low temperature, high and low temperature changes as well as the electric power and so on synthesis, exposed the defect of function board, such as welding, component parameter mismatch, temperature drift and the cause of faults in the debugging process, so that to eliminate, to the function of zero defect board will have the effect of stability parameter. Now when PCBA processing is carried out in the PCBA processing plant, it becomes a must option that the aging test will be conducted according to customer requirements or the characteristics of PCBA processing products. Then how to do it?


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There are three criteria for the PCBA aging test, according to which common problems can be found. Low temperature operation: after the control board is placed in the temperature of -10±3℃ for 1h, under this condition, it shall carry rated load, 187V and 253V, power on and run all procedures, the procedures shall be correct.


High temperature work: put the control board in 80±3℃/h, under this condition, with load, under the condition of 187V and 253V, power on and run all procedures, the procedures should be correct. High temperature and humidity operation: operate the control board at temperature of 65±3℃ and humidity of 90-95% for 48h with rated load powered on. All procedures shall be correct.


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The specific way of aging is: put the function board at the ambient temperature into the thermal aging equipment at the same temperature. PCBA processing products are in operation. The temperature in the device should then be reduced to the specified temperature value at the specified rate. After the temperature in the equipment reaches a stable level, PCBA processed products should be exposed to low temperature for 2h.


Then the temperature inside the device should rise to the specified temperature at the specified rate. After the temperature in the equipment reaches a stable level, PCBA processed products should be exposed to high temperature for 2h. The temperature in the device should then be reduced to room temperature at a specified rate. Repeat continuously until the specified aging time, and measure and record the PCBA processed products according to the specified aging time.


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